Printing method and printing device

Details Printing method and printing device Printing method and printing device

1997-08-28

2000-07-25

Yan, Ren

Printing

Stenciling

Processes

101123, B41M 112

Patent

active

060924632

ABSTRACT:
A printing method and a printing device are provided, whereby a uniform amount of solder can be coated, printing quality can be improved, variations in adjustment between operators are eliminated, adjustment time is shortened, and productivity can be improved. By keeping the amount of deformation of the end sections of a squeegee constant by maintaining a uniform state of contact between the squeegee and a stencil, there is no occurrence of such problems as unsatisfactory wiping away of a solder paste, which causes the solder paste to be left on the stencil, incomplete filling of the solder paste into the pattern opening, or an increase in the deformation of the end sections of the squeegee, causing solder paste filled into the pattern opening to be scraped away.

REFERENCES:
patent: 3943849 (1976-03-01), Vasilantone
patent: 4937097 (1990-06-01), Ichinose et al.
patent: 4949636 (1990-08-01), Techibana
patent: 5440980 (1995-08-01), Murakami et al.
patent: 5479854 (1996-01-01), Chikahisa et al.

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