Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2011-03-15
2011-03-15
Michener, Jennifer K (Department: 1728)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C136S256000, C136S252000
Reexamination Certificate
active
07906366
ABSTRACT:
A printing mask includes a mask frame and a mesh extended on the mask frame, in which a mask portion is formed by filling the mesh with resin to leave a pattern forming portion in a region corresponding to an electrode pattern to be formed on a printing object. The mask portion has a raised part on a surface of the mesh to be opposed to the printing object. The thickness of the raised part is such that a difference in average film thickness between the end and other parts of the electrode pattern formed with the printing mask is equal to or less than5micrometers.
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Japanese Office Action issued in Japanese Application No. 2006-515508, dated Jun. 1, 2010 and partial English translation thereof.
Makino Keizo
Nakatani Mitsunori
Tominaga Hisashi
Buchanan & Ingersoll & Rooney PC
Mershon Jayne
Michener Jennifer K
Mitsubishi Electric Corporation
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