Printing and adhering patterned metal on laid-up multi-layer gre

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

3613212, 361312, 361328, 3613011, H01G 400

Patent

active

057400105

ABSTRACT:
Metal, normally gold or platinum, is printed, and is adhered by a glass frit, on the top and/or bottom surfaces of a multi-layer laid-up green ceramic wafers containing typically up to 16 layers and 800+ separate devices, typically 800+ monolithic, buried-substrate, ceramic multiple capacitors. The wafer is diced, and the multiple ceramic capacitors each with its patterned surface metal are co-fired. The integrally formed, top and bottom surface, conduction traces connect similarly formed pads, typically disposed in a "pin-grid" pattern, to later-added side traces or conductive castellations that connect to the electrodes of multiple buried-substrate capacitors. The pads are precisely located, and extend over such ample areas, to support the stable surface mounting, and the reliable electrical connection of, diverse external electrical circuits and components. The surface mounting may be by and of adhering with conductive adhesive, soldering, reflow soldering, gold wire bonded, aluminum wire bonding, flip-chip mounting, die bonding and like processes, including automated processes. The pads on the bottom surface typically support mounting the ceramic multiple capacitor to a printed circuit board, flexible substrate, alumina substrate, multi-chip module or the like. Meanwhile, pads on the top surface typically support the physical mounting and electrical connection of one or more electrical circuits--including ICs--or components piggyback on top of the multiple capacitor, including in a dense three-dimensional multi-tier, tower, arrangement.

REFERENCES:
patent: 4882650 (1989-11-01), Maher et al.
patent: 5367430 (1994-11-01), DeVoe et al.
patent: 5625528 (1997-04-01), DeVoe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printing and adhering patterned metal on laid-up multi-layer gre does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printing and adhering patterned metal on laid-up multi-layer gre, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printing and adhering patterned metal on laid-up multi-layer gre will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-641611

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.