Printhead integrated circuit attachment film having...

Details Printhead integrated circuit attachment film having... Printhead integrated circuit attachment film having...

2008-03-17

2010-12-07

Huffman, Julian D (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S087000

Reexamination Certificate

active

07845755

ABSTRACT:
A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

REFERENCES:
patent: 5696546 (1997-12-01), Narang et al.
patent: 2007/0058007 (2007-03-01), Silverbrook et al.
patent: 2007/0206059 (2007-09-01), Ramachandra et al.
patent: 0671372 (1995-09-01), None
patent: 2007/098861 (2007-04-01), None

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