Metal fusion bonding – Process – Preplacing solid filler
Patent
1995-12-29
1998-06-30
Ramsey, Kenneth J.
Metal fusion bonding
Process
Preplacing solid filler
222590, 427422, B23K 306
Patent
active
057721068
ABSTRACT:
A compact printhead assembly is designed for employment in a soldering operation without the need for fluxes and without conducting the operation in a confined chamber. A self-contained printhead assembly has an internal reservoir and internal heating elements for raising the temperature above the melting temperature of solder or other liquid to be dispensed in microdroplets from a working surface at one end of the printhead housing. A jetting device containing an electro-mechanical transducer is pulsed to produced droplets at an exit orifice located at the working surface. Inert gas is preheated by the housing and delivered to the working surface to establish an oxygen-free atmosphere around the exit orifice and between the working surface and a substrate located a working distance away, whereby microdrops can be formed and deposited without harmful oxidation.
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Ayers Scott D.
Boldman Michael T.
Hayes Donald J.
Wallace David B.
Harrell Rain
MicroFab Technologies Inc.
Purnell Locke
Ramsey Kenneth J.
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