Printhead assembly with thermal equalization characteristics

Details Printhead assembly with thermal equalization characteristics Printhead assembly with thermal equalization characteristics

2007-01-30

2007-01-30

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Ink jet

Fluid or fluid source handling means

Reexamination Certificate

active

11250451

ABSTRACT:
A printhead assembly includes a support member of a composite material that defines at least one ink reservoir. A printhead integrated circuit is mounted on the support member. A substrate material of the printhead integrated circuit and the composite material both have substantially the same coefficient of thermal expansion.

REFERENCES:
patent: 6270196 (2001-08-01), Uno et al.
patent: 6676245 (2004-01-01), Silverbrook
patent: 2004/0095413 (2004-05-01), Silverbrook
patent: 6087213 (1994-03-01), None
patent: 10157105 (1998-06-01), None
patent: 99-11010861 (1999-01-01), None
patent: 2000-263768 (2000-09-01), None

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