Printhead array and method of producing a printhead die assembly

Details Printhead array and method of producing a printhead die assembly Printhead array and method of producing a printhead die assembly

1995-01-03

1997-04-15

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating thermal ink jet article

347 42, 438 21, 438456, 438458, 216 2, H01L 2100, G01D 1518, B44C 122

Patent

active

056206143

ABSTRACT:
A method of fabricating a pagewidth array of buttable printheads reduces end channel damage. The wafer containing a plurality of arrays of channels is provided with V-grooves. A V-groove is positioned between each array. When the wafer is secured to a wafer containing heater plates, wafers are diced along the V-shaped grooves to reduce damage to the end channels of the array to improve print quality.

REFERENCES:
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4786357 (1988-11-01), Campanelli et al.
patent: 4814296 (1989-03-01), Jedlicka et al.
patent: 4829324 (1989-05-01), Drake et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4878992 (1989-11-01), Campanelli
patent: 4961821 (1990-10-01), Drake et al.
patent: 5000811 (1991-03-01), Campanelli
patent: 5041190 (1991-08-01), Drake et al.
patent: 5128282 (1992-07-01), Ormond et al.
patent: 5160403 (1992-11-01), Fisher et al.
patent: 5219796 (1993-06-01), Quinn et al.

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