Printed-wiring substrate and method for fabricating the same

Details Printed-wiring substrate and method for fabricating the same Printed-wiring substrate and method for fabricating the same

2005-01-11

2005-01-11

Vigushin, John B. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C361S766000, C361S763000

Reexamination Certificate

active

06841740

ABSTRACT:
A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrate3is molded by placing a capacitor element13in a mold and charging a resin4into the mold. Therefore, the capacitor element13having a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chip15and stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor element13decreases, the printed-wiring substrate can be fabricated at reduced cost.

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