Printed wiring circuit guard ring

Electrical transmission or interconnection systems – Switching systems – Condition responsive

Patent

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Details

317101CC, H01H 3500, H01H 3506

Patent

active

039379809

ABSTRACT:
When a conventional printed wiring board is subjected to a harsh environment, leakage can develop between adjacent conductors over a period of time. If high impedance circuits are employed on the board, such leakage can adversely affect circuit performance. The effect of such leakage can be minimized if the circuit layout is so arranged that potentially troublesome leakage occurs only to elements that operate at comparable operating potentials. In one embodiment of the invention, a circuit is shown having a high impedance point on a printed wiring board intended for an automotive application. The high impedance wiring conductor is completely surrounded by a metal conductor that is connected to a potential point in the circuit that approximates the potential at which the high impedance point will operate. When the automotive environment results in surface leakage, there will be very little change in the operational character of the high impedance circuit.

REFERENCES:
patent: 3387208 (1968-06-01), Foley
patent: 3455411 (1969-07-01), Carp et al.

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