Printed wiring boards with superposed copper foils cores

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174255, 174262, 361414, H05K 100

Patent

active

050456423

ABSTRACT:
The invention provides a printed wiring board having a plurality of copper foil cores superposed over one another and spaced away from one another. The portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. Another printed wiring board has a plurality of copper foil cores superposed over one another and spaced away from one another. The end portions of the cores are exposed at the end surfaces of the board. A plurality of holes extend vertically through the copper foil cores and have hole-defining internal surfaces so plated as to connect the cores to one another. The underside of the copper foil core at the lowermost position is exposed at a recess formed on the rear side of the board. Plating is formed which extends from the lowermost copper foil core to the rear side of the board.

REFERENCES:
patent: 3243498 (1966-03-01), Allen et al.
patent: 3739469 (1973-06-01), Dougherty
patent: 4095866 (1978-06-01), Merrill
patent: 4616292 (1986-10-01), Sengoku et al.
patent: 4729061 (1988-03-01), Brown
patent: 4854038 (1989-08-01), Wiley

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