Electrical connectors – With circuit conductors and safety grounding provision – Direct grounding of coupling part member passing into aperture
Patent
1992-12-24
1995-05-23
Abrams, Neil
Electrical connectors
With circuit conductors and safety grounding provision
Direct grounding of coupling part member passing into aperture
H01R 909
Patent
active
054175780
ABSTRACT:
Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads.
REFERENCES:
patent: 3325766 (1967-06-01), Kolb
patent: 3461552 (1969-08-01), Wolf
patent: 4129349 (1978-12-01), von Roesgen
patent: 4361634 (1982-11-01), Miller
patent: 4451107 (1984-05-01), Dola et al.
patent: 4511197 (1985-04-01), Grabbe et al.
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4524240 (1985-06-01), Stock et al.
patent: 4583150 (1986-04-01), Boonstra
patent: 4616292 (1986-10-01), Senoku et al.
patent: 4647124 (1987-03-01), Kandybowski
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4762500 (1988-08-01), Dola et al.
patent: 4900258 (1990-02-01), Hnatuck et al.
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 5079671 (1992-01-01), Garrett et al.
patent: 5190473 (1993-03-01), Mroczkowski et al.
patent: 5308252 (1994-05-01), Mroczkowski
patent: 5310352 (1994-05-01), Mroczkowski
Rothenberger et al., High-Density Zero Insertion Force Microcoaxial Cable Interconnection Technology, pp. 1-5.
Mroczkowski Robert S.
Rothenberger Richard E.
Abrams Neil
Ness Anton P.
The Whitaker Corporation
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