Printed wiring board with zones of controlled thermal coefficien

Details Printed wiring board with zones of controlled thermal coefficien Printed wiring board with zones of controlled thermal coefficien

1985-12-16

1987-03-31

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428212, 428285, 428408, 4284735, 428901, 174 685, B32B 310, B32B 2700

Patent

active

046542485

ABSTRACT:
A printed wiring board with zones therein of controlled thermal coefficient of expansion including a first layer of first material, a second layer of second material and a third layer of a third material positioned between the first and the second layers. The third layer includes a first area whereat the material is removed and replaced with a control material possessing a thermal coefficient of expansion different from the first, second and third layers. The third layer and the control material each possess a first side bonded to a first side of the first layer and a second side bonded to a first side of a second layer to form the printed wiring board. Electronic components may be mounted on a second side of the first layer, the second layer, or both the first and second layers and the control material may be varied in composition and thickness to change thermal expansion in the zone above and below the control material. The control material may be thermally conductive and extend to a side of the board where it may contact a heat sinking board guide to provide a path for dissipating heat generated by the electronic components.

REFERENCES:
patent: 3801880 (1974-04-01), Harada et al.
patent: 3897588 (1975-07-01), Nohtomi
patent: 3955024 (1976-05-01), Goldman et al.
patent: 3956561 (1976-05-01), Anderson et al.
patent: 4318954 (1982-03-01), Jensen
patent: 4388136 (1983-06-01), Huie et al.
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4526835 (1985-07-01), Takahashi et al.

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