Printed wiring board with test pattern for through holes

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174262, 29593, 29709, H05K 100

Patent

active

051824213

ABSTRACT:
A printed wiring board comprises a board member having a major surface virtually broken down into a first zone and a second zone, and at least one through-hole of a predetermined diameter is open at the first zone of the major surface, wherein an electrically conductive test pattern with a first conductive sub-pattern and a second conductive sub-pattern spaced apart from each other is formed on the second zone of the major surface, a first test hole of the first predetermined diameter being formed in the first conductive sub-pattern in such a manner as to split the first conductive sub-pattern into two disconnected pieces without breakage of the second conductive sub-pattern in so far as the first predetermined diameter is matched with a design specification, thereby easily checking the at least one through-hole by using current to see whether or not the predetermined diameter is correct.

REFERENCES:
patent: 4208783 (1980-06-01), Luther et al.
patent: 4510446 (1985-04-01), Braun et al.
patent: 4748773 (1988-06-01), Dawson et al.
patent: 4878315 (1989-11-01), Dawson et al.

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