Printed wiring board with mounted circuit element using a termin

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361763, 361762, 361767, 361790, 361792, 361803, 361807809-, 257723, 257724, 257737, 257738, 257773, 257774, 257698, 174250, 174255, 174266, H05K 114

Patent

active

059368438

ABSTRACT:
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

REFERENCES:
patent: 5036431 (1991-07-01), Adachi et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5481435 (1996-01-01), Werther
patent: 5614766 (1997-03-01), Takasu et al.

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