Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-02-27
2007-02-27
Reichard, Dean A. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C174S262000, C174S524000, C174S534000, C174S557000, C257S737000, C257S776000
Reexamination Certificate
active
10740459
ABSTRACT:
To provide a printed wiring board where the impedance between pads through which differential signals pass has been set to a predetermined standard value. The printed wiring board includes a first conductor layer extending over an area excluding a hole formed for each pad group and filled with a dielectric, and a second conductor layer extending over an area containing areas facing the hole. The hole encompasses a plurality of areas facing predetermined respective pads which are adjacent to each other and which form the pad group from among the plurality of pads.
REFERENCES:
patent: 4998159 (1991-03-01), Shinohara et al.
patent: 5488542 (1996-01-01), Ito
patent: 5569390 (1996-10-01), Endo
patent: 5586006 (1996-12-01), Seyama et al.
patent: 6191479 (2001-02-01), Herrell et al.
patent: 6555763 (2003-04-01), Hirasawa et al.
patent: 6803655 (2004-10-01), Fujio et al.
patent: 6855892 (2005-02-01), Komatsu et al.
patent: 2002/0074162 (2002-06-01), Su et al.
patent: 5-029772 (1993-02-01), None
patent: 05029772 (1993-02-01), None
Fujitsu Limited
Nguyen Hoa C.
Reichard Dean A.
Staas & Halsey , LLP
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