Printed wiring board with grounding lines arranged between wirin

Details Printed wiring board with grounding lines arranged between wirin Printed wiring board with grounding lines arranged between wirin

1997-05-01

2000-06-06

Hilten, John

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 72TR, H05K 102

Patent

active

06072126&

ABSTRACT:
A circuit board comprises: a plurality of solder lands, a wiring pattern having a plurality of wiring lines connected to the solder lands, respectively, an output terminal formed at one end of each of the wiring lines of the wiring pattern, an integrated control circuit connected to the solder lands, and a grounding pattern to be held at a ground potential. The grounding pattern has grounding lines formed between the adjacent wiring lines of the wiring pattern, respectively, so as to be coupled to the wiring lines by capacitive coupling.

REFERENCES:
patent: 3398232 (1968-08-01), Hoffman
patent: 4127740 (1978-11-01), LaMarche
patent: 4615604 (1986-10-01), Yamada
patent: 4780157 (1988-10-01), Coon
patent: 4857684 (1989-08-01), Gratke
patent: 5155570 (1992-10-01), Tomizuka et al.
patent: 5281765 (1994-01-01), Iura et al.
patent: 5523755 (1996-06-01), Wooten
patent: 5844783 (1998-12-01), Kojima

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