Printed wiring board with an electronic wave shielding layer

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174260, 174258, 174254, 174 35R, H05K 100

Patent

active

050308009

ABSTRACT:
A printed wiring board for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion including a possible plated through hole, a printed wiring circuit provided on one or both surface of the insulating sheet, an insulating layer provided on a part of the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and a part of the printed wiring circuit, a solder resist provided on the electromagnetic wave shielding layer and a sealing member of heat-resistant material or weather-resistant material which is filled or packed in the connecting through hole portion.

REFERENCES:
patent: 3385773 (1968-05-01), Frantzen
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4649461 (1987-03-01), Matsuta

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