Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Reexamination Certificate
2008-03-04
2008-03-04
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
C439S055000
Reexamination Certificate
active
11585959
ABSTRACT:
A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.
REFERENCES:
patent: 5709576 (1998-01-01), Lippmann et al.
patent: 5772448 (1998-06-01), Ekrot et al.
patent: 6191479 (2001-02-01), Herrell et al.
patent: 6455941 (2002-09-01), Lee et al.
patent: 6778198 (2004-08-01), Dances
patent: 7084499 (2006-08-01), Shen
patent: 7265440 (2007-09-01), Zilber et al.
patent: 2002/0074162 (2002-06-01), Su et al.
patent: 2004/0144562 (2004-07-01), Ishikawa
patent: 2006/0022310 (2006-02-01), Egitto et al.
patent: 2007/0012475 (2007-01-01), Kawaguchi et al.
patent: 06-168297 (1994-06-01), None
patent: 09-097957 (1997-04-01), None
patent: 2002-009511 (2002-01-01), None
patent: 2003-282768 (2003-10-01), None
patent: 2004-228478 (2004-08-01), None
Aoki Kazumasa
Miyanishi Hideji
Motohashi Kenji
Yanagimoto Takashi
Harness & Dickey & Pierce P.L.C.
Prasad Chandrika
Ricoh & Company, Ltd.
LandOfFree
Printed wiring board with a plurality of pads and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed wiring board with a plurality of pads and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board with a plurality of pads and a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3948144