Printed wiring board to which solder has been applied

Details Printed wiring board to which solder has been applied Printed wiring board to which solder has been applied

1992-06-29

1994-05-24

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, 174261, 361760, H05K 100

Patent

active

053150708

ABSTRACT:
A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump-shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.

REFERENCES:
patent: 2615768 (1947-04-01), Schluchter
patent: 4339785 (1982-07-01), Ohsawa
patent: 4485166 (1984-11-01), Herwig et al.
patent: 4752027 (1988-06-01), Gschwend
patent: 5024372 (1991-06-01), Altman et al.
patent: 5047714 (1991-09-01), Maeno et al.
American Society for Metals, Metals Park, Ohio 44073, Metals Handbook Ninth Edition, vol. 6, Soldering/1071.
Derwent--WPOL No. 89-367154, Derwent Publications Ltd. London, GB, JP-A-1244491 (AIWA K.K.)Nov. 22, 1989.
"Optipad--A Printed Wiring Board Surface for Optimizing Reflow Soldering Techniques in Terms of Processes and Metallurgy in SMT" 1990 Int'l. Conf. on SMT/ASIC/Hybrids.

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