Printed wiring board substrates for ceramic chip carriers

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174 685, 427 96, 427 97, 428212, 428241, 428408, 428901, B32B 300, B32B 900, B05D 512

Patent

active

043189547

ABSTRACT:
A composite printed wiring board is provided wherein the surface of the board is fabricated from conventional fiber reinforced plastic laminates such as glass fiber reinforced epoxy laminates and that laminate is secured by means of a thermoset adhesive to a support member which is fabricated from graphite filament reinforced thermoset resin having a low coefficient of thermal expansion approaching zero. The unrestrained coefficient of thermal expansion of the printed wiring board is significantly greater than that of the support member. However, in the composite assembly, the apparent coefficient of thermal expansion of the printed wiring board is greatly reduced and can approximate the coefficient of thermal expansion of a ceramic chip carrier. The coefficient of thermal expansion of the printed wiring board in its thickness direction is only slightly reduced in the composite assembly.

REFERENCES:
patent: 3700538 (1972-10-01), Kennedy
patent: 4103102 (1978-07-01), Klein
patent: 4249302 (1981-02-01), Crepeau
patent: 4279783 (1981-07-01), Kehrer et al.
patent: 4284664 (1981-08-01), Rauch

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed wiring board substrates for ceramic chip carriers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board substrates for ceramic chip carriers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board substrates for ceramic chip carriers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1840911

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.