Printed wiring board substrate for surface mounted components

Details Printed wiring board substrate for surface mounted components Printed wiring board substrate for surface mounted components

1985-03-05

1990-10-16

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

174250, 428209, 428210, 428323, 428328, 428704, 428901, H05K 103, B32B 702

Patent

active

049634259

ABSTRACT:
A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.

REFERENCES:
patent: 4294877 (1981-10-01), Graham
patent: 4299873 (1981-11-01), Ogihara et al.
patent: 4318954 (1982-03-01), Jensen
patent: 4429216 (1984-01-01), Brigham
patent: 4452847 (1984-06-01), Siemon
patent: 4492730 (1985-01-01), Oishi et al.
patent: 4513055 (1985-04-01), Leibowitz
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4526835 (1985-07-01), Takahashi et al.

Affiliated with

Also associated with

Rating

Printed wiring board substrate for surface mounted components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board substrate for surface mounted components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board substrate for surface mounted components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-849156