Printed wiring board shielded from electromagnetic wave

Details Printed wiring board shielded from electromagnetic wave Printed wiring board shielded from electromagnetic wave

1991-10-15

1993-11-16

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, H05K 100

Patent

active

052625966

ABSTRACT:
A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.

REFERENCES:
patent: 3647585 (1972-03-01), Fritzinger et al.
patent: 4118595 (1978-10-01), Pfahnl et al.
patent: 4141055 (1979-02-01), Berry et al.
patent: 4801489 (1989-01-01), Nakagawa et al.

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