Printed-wiring board, printed-circuit board and electronic...

Details Printed-wiring board, printed-circuit board and electronic... Printed-wiring board, printed-circuit board and electronic...

2007-11-27

2007-11-27

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C174S256000, C174S260000, C174S262000, C174S266000, C361S760000, C257S079000, C257S503000, C257S668000, C257S700000, C257S784000, C029S830000, C029S831000, C029S840000

Reexamination Certificate

active

11352293

ABSTRACT:
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost layers of the conducting layers which includes a plurality of pad portions which are provided in positions opposite to a plurality of signal terminals of a connector component arranged in a predetermined form and perform electrical connection, reinforcing portions which are provided to extend from the pad portions respectively in a lengthwise direction, and land portions to perform the electrical connection to another layer of the conducting layers, and a solder resist provided on the outermost layer of the conducting layers to cover the reinforcing portion and having an opening portion to expose the pad portion.

REFERENCES:
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patent: 2003/0201123 (2003-10-01), Kistner
patent: 2004/0238825 (2004-12-01), Lim et al.
patent: 2006/0082001 (2006-04-01), Miyagawa
patent: 2006/0102700 (2006-05-01), Huang et al.
patent: 2004-006538 (2005-01-01), None

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