Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1994-11-17
1996-05-28
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257797, H01L 23495, H01L 23544
Patent
active
055214274
ABSTRACT:
A packaged semiconductor device, leadframe for making same, and method of mounting same to a printed circuit board are described. The device has a body, and a plurality of leads extending from the body. One or more alignment features are formed on the exterior of the package body, for maintaining precise alignment of the device with respect to a printed wiring board. The alignment feature is a tab formed as part of portion of the leadframe external to the package body. The tab may have various shapes, and may be provided with a hole for registering with a pin on an underlying substrate, such as a printed wiring board. The pin and the tab may be electrically connected.
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Microelectronics Packaging Handbook, Plastic Packaging Encapsulation Processes, pp. 578-591, 1988.
Chia Chok J.
Lim Seng-Sooi
Arroyo T. M.
Limanek Robert P.
LSI Logic Corporation
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