Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-06-21
2011-06-21
Patel, Ishwarbhai B (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000
Reexamination Certificate
active
07964800
ABSTRACT:
A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.
REFERENCES:
patent: 6002172 (1999-12-01), Desai et al.
patent: 6028357 (2000-02-01), Moriyama
patent: 6218030 (2001-04-01), Miyake et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6384339 (2002-05-01), Neuman
patent: 6449836 (2002-09-01), Miyake et al.
patent: 6546622 (2003-04-01), Iba et al.
patent: 6589870 (2003-07-01), Katoh
patent: 6809415 (2004-10-01), Tsukada et al.
patent: 2002/0045135 (2002-04-01), Watanabe
patent: 2006/0244140 (2006-11-01), Hu
patent: 2008/0138505 (2008-06-01), Takai et al.
patent: 8-23147 (1996-01-01), None
patent: 08-023147 (1996-01-01), None
patent: 09-046031 (1997-02-01), None
patent: 2000-228580 (2000-08-01), None
patent: 2001-332582 (2001-11-01), None
patent: 2006-13160 (2006-01-01), None
patent: I243007 (2005-11-01), None
Kitada Tomofumi
Maruo Hiroki
Takami Ryo
Fujikura Ltd.
Patel Ishwarbhai B
Sughrue & Mion, PLLC
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