Printed wiring board manufacturing method

Details Printed wiring board manufacturing method Printed wiring board manufacturing method

2005-12-27

2008-10-14

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S847000, C216S018000, C174S262000

Reexamination Certificate

active

07434311

ABSTRACT:
This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate with a photosensitive dry film, and developing and hardening the photosensitive dry film as a plating resist; and copper-plating the inside of the through holes and the opening periphery thereof. The manufacturing method further comprises the steps of coating the copper-plated area with a metal protective film, eliminating the photosensitive dry film; forming a circuit pattern; and conducting an overlaying treatment as a post-processing step.

REFERENCES:
patent: 4486466 (1984-12-01), Leech et al.
patent: 6120670 (2000-09-01), Nakajima
patent: 6210537 (2001-04-01), Murphy et al.
patent: 6242078 (2001-06-01), Pommer et al.
patent: 11-195849 (1999-07-01), None
patent: 2004-291202 (2004-10-01), None

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