Printed wiring board, information processing apparatus, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S786000, C257S776000, C257S773000, C361S777000, C361S778000

Reexamination Certificate

active

07541678

ABSTRACT:
Disclosed is a printed wiring board comprising an insulating layer having a rectangular flat shape and provided with fibers in the layer, the direction of the fiber in the layer being almost parallel to any side of the rectangle, a reference potential layer disposed on one surface side of the insulating layer, a plurality of wiring patterns for signal transmission disposed on the other surface side of the insulating layer so as to have nearly similar angles respectively with respect to the direction of the fiber in the insulating layer, and a pad portion to mount a semiconductor device, disposed on the other surface side of the insulating layer to conduct the plurality of wiring patterns.

REFERENCES:
patent: 5334800 (1994-08-01), Kenney
patent: 5348792 (1994-09-01), Hattori et al.
patent: 5682124 (1997-10-01), Suski
patent: 6707682 (2004-03-01), Akiba et al.
patent: 7292454 (2007-11-01), Farkas et al.
patent: 2005/0146403 (2005-07-01), Okubora
patent: 2003-535743 (2003-12-01), None
patent: WO 01/94134 (2001-12-01), None
Intel, “PCI Express Board Design Guidelines—Draft,” Intel Corporation, http://www.express-lane.org, p. 1-41, (2003).

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