Printed wiring board including power supply layer and ground...

Details Printed wiring board including power supply layer and ground... Printed wiring board including power supply layer and ground...

2006-03-16

2008-09-23

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S792000, C361S795000

Reexamination Certificate

active

07428155

ABSTRACT:
A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interposed between the first and second power supply layers as well as between the first and second ground layers. A capacitor is interposed between the first and second electrically-conductive pieces. Power supply noise is forced to inevitably pass through the electrically-conductive pieces. The power supply noise thus reliably flows into the capacitor through the first and second electrically-conductive pieces. A printed wiring board is in this manner allowed to enjoy a sufficient suppression of the power supply noise.

REFERENCES:
patent: 6104258 (2000-08-01), Novak
patent: 6166457 (2000-12-01), Iguchi et al.
patent: 6198362 (2001-03-01), Harada et al.
patent: 6937480 (2005-08-01), Iguchi et al.
patent: 6-244562 (1994-09-01), None
patent: 11-233951 (1999-08-01), None

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