Printed wiring board having wiring patterns and connection...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S256000, C174S267000

Reexamination Certificate

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06940024

ABSTRACT:
Wiring patterns are made of a conductive material containing Ag particles that exhibit high conductivity. Connection terminals that are connected to the ends of part of the wiring patterns, respectively, are made of a conductive material containing conductive particles in each of which an Au coating layer is formed on the surface of a conductive core particle. The connection terminals are arranged parallel with each other at small intervals on a narrow insertion portion of a flexible insulative board without being covered with respective conductive coatings.

REFERENCES:
patent: 4774634 (1988-09-01), Tate et al.
patent: 4815981 (1989-03-01), Mizuno
patent: 4830779 (1989-05-01), Maeno et al.
patent: 4859808 (1989-08-01), Jeter et al.
patent: 5042971 (1991-08-01), Ambrose
patent: 5045141 (1991-09-01), Salensky et al.
patent: 5174925 (1992-12-01), Fujii et al.
patent: 6016598 (2000-01-01), Middelman et al.
patent: 6108210 (2000-08-01), Chung
patent: 6278618 (2001-08-01), Lee et al.
patent: 101962/1998 (1998-04-01), None

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