Printed wiring board having through-holes covered with ink layer

Details Printed wiring board having through-holes covered with ink layer Printed wiring board having through-holes covered with ink layer

1991-03-15

1993-11-30

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174264, 361767, 361818, H05K 100

Patent

active

052667480

ABSTRACT:
A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.

REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 4389771 (1983-07-01), Cassidy
patent: 4801489 (1989-01-01), Nakagawa
patent: 4806706 (1989-02-01), Machida
patent: 4933305 (1990-06-01), Kikkawa
patent: 4967313 (1990-10-01), Berner

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