Printed wiring board having shielding layer

Details Printed wiring board having shielding layer Printed wiring board having shielding layer

1991-10-04

1994-03-15

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 36, 174255, 174362, 361808, H05U 0100

Patent

active

052947556

ABSTRACT:
A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.

REFERENCES:
patent: 4311749 (1982-01-01), Hiraiwa
patent: 4327247 (1982-04-01), Mituhashi et al.
patent: 4383363 (1983-05-01), Hayakawa
patent: 4801489 (1989-01-01), Nakagawa
patent: 4830691 (1989-05-01), Kida
McDermott, C. J. Face Protection of Printed Circuit Boards, IBM Disclosure, vol. 11, No. 7, December 1968, p. 733.

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