Printed wiring board having shielding layer

Details Printed wiring board having shielding layer Printed wiring board having shielding layer

1990-03-15

1993-06-15

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, 174255, 428901, H05K 100

Patent

active

052201350

ABSTRACT:
A printed wiring board having a shielding layer for use in an integrated circuit is disclosed. The printed wiring board comprises an insulating sheet having a connecting through hole portion, a printed wiring circuit provided on one or both surfaces of the insulating sheet, an insulating layer having a thickness of 20.about.50 .mu.m which is provided on the printed wiring circuit, and an electromagnetic shielding layer provided on the insulating layer.

REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa
patent: 4801489 (1989-01-01), Nakagawa
patent: 4804575 (1989-02-01), Kohm
patent: 4973799 (1990-11-01), Soma et al.

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