Printed wiring board having robber pads for excess solder

Details Printed wiring board having robber pads for excess solder Printed wiring board having robber pads for excess solder

1988-09-15

1989-05-30

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29843, 361403, H05K 100, H05K 334

Patent

active

048353450

ABSTRACT:
A printed wiring board is disclosed which has one or more solder pads of special configuration which receive and contain excess solder which might otherwise bridge adjacent downstream leads of a component having closely spaced leads when the component is mounted to the printed circuit board in a wave-soldering process. The special solder pad configuration may be viewed as an extra solder pad (a "robber pad") at the downstream end of a linear array of solder pads which is connected to the adjacent upstream solder pad by a solder-wettable bridge.

REFERENCES:
patent: 3567844 (1971-03-01), Kremar
patent: 3610811 (1971-10-01), O'Keefe
patent: 3644792 (1972-02-01), Fields
patent: 3833838 (1974-09-01), Christiansen
patent: 3865298 (1975-02-01), Allen et al.
patent: 3883682 (1975-03-01), Cagle et al.
patent: 3923359 (1975-12-01), Newsam
patent: 4343084 (1982-08-01), Wilmarth
patent: 4464704 (1984-08-01), Huie et al.
patent: 4638116 (1987-01-01), Gumb
Donald A. Elliott, "Hot Air Leveling of Printed Wiring Boards", Presented at Nepcon-East, Philadelphia, May 17-19, 1977.
Western Electric Technical Digest No. 20, "Programmable Through-Hole Connection", J. M. Glasson and F. K. Heffley, Oct. 1970.

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