Printed-wiring board having plural parallel-connected interconne

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

174254, 361749, 361784, 439 67, 439 77, H05K 111, H01R 909

Patent

active

057175560

ABSTRACT:
In a printed-wiring board, first and second hard substrates each having electronic components mounted thereon are connected through a flexible substrate interposed therebetween. A circuit pattern printed on each of the hard and flexible substrates electrically connects the electronic components mounted on the hard substrates through the flexible substrate. The circuit pattern includes a plurality of parallel-connected signal lines. The parallel-connected signal lines are spatially separated on the flexible substrate, and the both ends of the parallel-connected signal lines are located in the hard substrates, respectively. A single signal line of the circuit pattern branches on one hard substrate into the parallel-connected signal lines, which extend through the flexible substrate and are converged to a single signal line on the other hard substrate.

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