Printed wiring board having inner test-layer for improved test p

Details Printed wiring board having inner test-layer for improved test p Printed wiring board having inner test-layer for improved test p

1997-12-18

2000-08-15

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

3241581, 324537, 324765, 361795, 361799, 174262, H05K 116

Patent

active

061039780

ABSTRACT:
A multilayered printed wiring board (PWB) with improved probing for in-circuit, functional, and prototype testing. The PWB includes a support layer and at least a top layer disposed over the support layer. The top layer has one or more circuits with traces for measuring signals produced by the circuit. A test-layer for routing the signals to the edge of the board is provided between the top layer and the support layer. The test-layer includes long traces extending from a first location substantially beneath the traces to a second location adjacent to the edge of the board. Contacts for measuring the signals produced by the circuit are provided on the top layer adjacent to the edge of the board. A first set of vias may be used to connect the first ends of the long traces to the traces on the top layer and a second set of vias may be used to connect the second ends of the long traces to the contacts. Buried resistors embedded in the test-layer may be provided for connecting the first set of vias with the long traces to create resistive coupling and low-level feedback for probing of the circuit at the contacts.

REFERENCES:
patent: 3963986 (1976-06-01), Morton et al.
patent: 5375040 (1994-12-01), Cooper et al.
patent: 5723908 (1998-03-01), Fuchida et al.

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