Printed wiring board having impedance-matched differential...

Details Printed wiring board having impedance-matched differential... Printed wiring board having impedance-matched differential...

2005-12-06

2005-12-06

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C361S794000

Reexamination Certificate

active

06972380

ABSTRACT:
A printed wiring board having differential pair signal traces has increased spacing between signal-carrying vias and ground or power planes and/or is equipped with selectively placed ground vias to enhance the impedance matching of the signal traces.

REFERENCES:
patent: 4870746 (1989-10-01), Klaser
patent: 5010641 (1991-04-01), Sisler
patent: 5191174 (1993-03-01), Chang et al.
patent: 5475264 (1995-12-01), Sudo et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 6384341 (2002-05-01), Rothermel et al.
patent: 6392164 (2002-05-01), Iwaki et al.
patent: 6767252 (2004-07-01), McGrath et al.
patent: 6787710 (2004-09-01), Uematsu et al.
patent: 02001053397 (2001-02-01), None

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