Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-30
2006-05-30
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S707000, C257S706000, C174S016300, C165S080300, C165S185000
Reexamination Certificate
active
07054159
ABSTRACT:
In the present invention, a printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, includes a heat radiating device mounted at a position corresponding to the electronic component on a rear surface of the circuit board.
REFERENCES:
patent: 5258887 (1993-11-01), Fortune
patent: 5506755 (1996-04-01), Miyagi et al.
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 6058013 (2000-05-01), Christopher et al.
patent: 6084776 (2000-07-01), Cuntz et al.
patent: 6201701 (2001-03-01), Linden et al.
patent: 6205028 (2001-03-01), Matsumura
patent: 6212071 (2001-04-01), Roessler et al.
patent: 6222732 (2001-04-01), Jakob et al.
patent: 6226183 (2001-05-01), Weber et al.
patent: 6260610 (2001-07-01), Biber et al.
patent: 6305463 (2001-10-01), Salmonson
patent: 404113695 (1992-04-01), None
patent: 405082686 (1993-04-01), None
Chervinsky Boris
Morgan & Lewis & Bockius, LLP
ROHM Co. Ltd.
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