Printed wiring board having electromagnetic wave shielding layer

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174254, 174257, 174258, 174 35R, H05K 0100

Patent

active

050251163

ABSTRACT:
A printed wiring board having electromagnetic wave shielding layer for use in the integrated semiconductor circuit is disclosed. The printed wiring board comprises an insulating sheet, printed wiring circuits and grounded wiring circuit which are provided on one surface of the insulating sheet, an insulating layer provided on the surface of the insulating sheet, the printed wiring circuit and the grounded wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer and having a portion contacted to the ground wiring circuit directly, and an over-coating layer provided on the electromagnetic wave shielding layer and having exposed portions placed over the contacted portion of the shielding layer.

REFERENCES:
patent: 4647714 (1987-03-01), Goto
patent: 4675786 (1987-06-01), Mizuko et al.

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