Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2001-05-16
2003-04-29
Talbott, David L. (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C174S264000, C174S266000, C361S767000, C361S792000, C361S795000
Reexamination Certificate
active
06555756
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a printed wiring board for use in mounting or packaging electronic parts therein, and in particular a printed wiring board having a cavity for mounting electronic parts therein and a method for manufacturing thereof, thereby enabling to mount the electronic parts, for example on a mother board, etc., with high density thereof.
2. Description of the Prior Art
Conventionally, mounting or packaging is carried out by loading plural numbers of electronic parts or components, such as semiconductor elements and/or chip-like parts, etc., on a surface of a plate-like printed wiring board, on which a predetermined circuit patterns are formed, so as to form a module (or a module board), and this module obtained is further piled on a motherboard, etc., flatly, in a form of a hybrid IC.
By referring to
FIG. 11
, explanation will be given on packaging condition where the electronic parts are mounted on the plate-like printed wiring board
10
of the conventional art, so as to form the module therewith, and after that this is piled on the motherboard flatly.
First of all, on the plate-like printed wiring board
10
of a single or multi-layered substrate or board are formed conductor layers
3
, such as predetermined circuit patterns, lands for use in connection of electronic parts, plated through-holes
4
, and side end-surface electrodes
5
, etc. After that, chip-like electronic parts
3
are fixed upon the surfaces of the lands
3
, which are formed on the surface of the plate-like printed wiring board
10
mentioned above, thereby being electrically connected therewith.
Next, the module board mounting the plural numbers of the chip-like electronic parts
30
thereon is heated and mounted, to be connected onto connector terminals
45
provided on the motherboard
40
, with using side end-surface electrodes
5
which are provided on the plate-like printed wiring board
10
. However, for the purpose of mounting the module board, on which the plural number of the chip-like electronic parts
30
are mounted, on the motherboard
40
with stability, in general, no such an element, as the chip-type electronic parts
30
, is mounted on a lower surface of said the plate-like printed wiring board
10
, which defines a reverse surface side thereof.
On the other hand, when the module board, being formed by mounting the chip-like electronic parts
30
on both side surfaces of the plate-like printed wiring board
10
mentioned above, is mounted on the motherboard
40
, it is fixed on the motherboard
40
through a spacer plate, a connector, and/or a pin board, etc., which is/are attached on the reverse side flat surface of the module plate, i.e., a mounted side (a lower side) thereof.
Accompanying by high- and multi-functions required for electronic and electric equipments in the recent years, those requirements of such the high- and multi-functions are also demanded onto the module board and the hybrid IC, etc. Accordingly, also for the printed wiring board, such the requirements of such the high- and multi-functions, as well as of high density and minuteness in lines to be formed, are made strongly, therefore the printed wiring board is needed to be more complex in the form and structure thereof.
For achieving such the high-density mounting required for the printed wiring board, so-called a flat through-hole is already known, as is disclosed in Japanese Patent Laying-open No. Hei 4-91489 (1992), wherein electrically insulating resin is filled up and harden within the plated through-holes formed on the wiring board, to be formed with connector portions, such as the bonding pads and/or the connector lands, upon the surfaces thereof, thereby utilizing even the surfaces of the plated through-holes formed thereon.
As was mentioned in the above, in the conventional art, in general, no such the chip-like electronic element is allowed to be mounted on the reverse side surface (i.e., the lower side surface) of the plate-like printed wiring board, because of the surface to be mounted on. However, for the purpose of improving the mounting density, it is required that the chip-like electronic parts can be mounted, not only the surface of the plate-like printed wiring board, but also on the reverse side surface thereof. And, for mounting such the module board, on both surfaces of which the chip-like electronic parts are mounted, on the motherboard closely contact therewith, there is a necessity of floating it up from the surface of the motherboard, with aid of attaching the spacers and/or the connectors at a lower side (i.e., the lower surface) of the module plate, which faces or confronts to the motherboard.
However, if floating up the plate-like printed wiring board by means of such the spacers and/or the connecters, so as to mount it on the motherboard, it is difficult to mount it on the motherboard with stability, i.e., it is difficult to mount the chip-like electronic parts on the lower side (i.e., the lower surface) of the plate-like printed wiring substrate, flatly and closely contacted with, as well as, with high mounting density thereof.
SUMMARY OF THE INVENTION
An object of the present invention, accordingly, for dissolving such the problems of the conventional art mentioned above, is to provide a printed wiring board having a cavity for mounting the electronic parts therein and a method for manufacturing thereof, namely, enabling to mount the chip-like electronic parts, not only the surface of the plate-like wiring board, but also on the reverse side surface thereof, thereby achieving mounting or packaging of the chip-like electronic parts with high density, while keeping them closely contact with, and horizontally on the motherboard.
According to the present invention, for accomplishing such the object as mentioned above, there is provided a printed wiring board, comprising:
an upper wiring substrate having flat surfaces on both sides thereof;
a lower plate body being fixed on the reverse side surface said upper wiring substrate, and being formed with a cavity therein, for receiving an electronic part within an inside thereof;
conductor layers being formed upon the surface of said upper wiring substrate, for mounting an electronic part thereon;
conductor layers being formed on a reverse side surface said upper wiring substrate, for mounting an electronic part thereon, facing to a region where said cavity is defined by said lower plate body, and being electrically connected with the conductor layers formed on the surface of said upper wiring substrate, respectively; and
external electrodes being formed on portions of an outer peripheral surface of said upper wiring substrate and said lower plate body formed in one body, and being electrically connected with said conductor layers, respectively, for mounting said printed wiring board on an outside substrate.
Also, according to the present invention, on the printed wiring board mentioned above, a plated through-hole is formed between the surfaces of the upper wiring substrate, for interconnecting the conductor layers, to be mounted with an electronic parts on the both sides of said upper wiring plate, and is filled with electrically non-conductive resin in an inside thereof, or alternatively a flat through-hole may be formed in the place thereof. Herein, the “flat through-hole (or flat plated through-hole)” means the structure or method for forming the conductor layer(s) to be a circuit conductor or a conductor pad for use in mounting of electronic parts thereon, with aggressively utilizing both side surfaces or one surface of so-called “a buried through-hole” formed in the substrate, within plated electrode of which is filled up or buried the non-conductive resin, and it is also the same in the explanations given hereinafter. Also, in the following explanations, the “through-hole” means the plated through-hole, having the inner electrode formed on the wall surface of the hole through plating, even when omitting the word “plated” at a head thereof.
Further, according
Ishikawa Kazumitsu
Kudoh Hiroyuki
Nakamura Yasuaki
Sakurai Masayuki
Antonelli Terry Stout & Kraus LLP
Hitachi AIC Inc.
Patel I B
Talbott David L.
LandOfFree
Printed wiring board having cavity for mounting electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed wiring board having cavity for mounting electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board having cavity for mounting electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3017878