Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-08-31
1998-04-07
Kincaid, Kristine L.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174264, 174252, 361830, H05K 102
Patent
active
057366810
ABSTRACT:
There are provided conductive bumps arranged at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet in a plastic state or up to a temperature not lower than the glass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough. This permits positive connections with a high accuracy without forming a through-hole.
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Arai Yasushi
Hamano Hiroshi
Motomura Tomohisa
Sato Yoshizumi
Yamamoto Yuichi
Ghosh Paramita
Kabushiki Kaisha Toshiba
Kincaid Kristine L.
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