Printed wiring board having a cover lay laminated on a polyimide

Details Printed wiring board having a cover lay laminated on a polyimide Printed wiring board having a cover lay laminated on a polyimide

1995-10-04

1997-05-27

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, H05K 102

Patent

active

056334800

ABSTRACT:
Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.

REFERENCES:
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5045642 (1991-09-01), Ohta et al.
patent: 5095628 (1992-03-01), McKenney et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5499444 (1996-03-01), Doane, Jr. et al.

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