Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-05-14
1988-09-27
Kittle, John E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
427 96, 361386, 361401, 156150, 156250, 156901, 156902, B32B 3100
Patent
active
047739550
ABSTRACT:
A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board an metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.
REFERENCES:
patent: 4410927 (1983-10-01), Butt
patent: 4573103 (1986-02-01), Nilsson
Komura Toshimi
Mabuchi Katsumi
Ibiden Co. Ltd.
Kittle John E.
Ryan P. J.
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