Printed wiring board assemblies

Details Printed wiring board assemblies Printed wiring board assemblies

1997-11-03

1999-10-19

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

156153, H05K 334

Patent

active

059668040

ABSTRACT:
A method of manufacturing a high-performance printed wiring board assembly, and the resulting product, utilize a substrate component that has a reinforcement material embedded in a condensation-reacted and thermally-crosslinked nadic end-capped polyimide resin electrically conductive lamina component pathways directly adhered to the substrate component resin and high-temperature soldered or otherwise attached connections that electrically join the conductor leads of included electrical devices to the lamina component conductive pathways.

REFERENCES:
patent: 4648925 (1987-03-01), Goepfert et al.
patent: 5424133 (1995-06-01), Eckhardt et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5614606 (1997-03-01), Chaudhari et al.
patent: 5693157 (1997-12-01), Kingston
patent: 5740605 (1998-04-01), Peterson

Affiliated with

Also associated with

Rating

Printed wiring board assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2041825