Printed wiring board, apparatus for electrically connecting...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S260000, C174S261000, C228S207000

Reexamination Certificate

active

06924440

ABSTRACT:
An apparatus for electrically connecting an electronic element and a base includes an electrode region and a terminal region proximate the electrode region. A conductive paste is deposited on at least a portion of the terminal region. The conductive paste has an oxidation-reduced region thereon, formed by application of an acid to the conductive paste. An oxidation-prevention layer is formed on the oxidation-reduced region by deposition of a flux on the oxidation-reduced region, application of a solder to the flux, and blowing of a heated gas by the solder. The oxidation-prevention layer is adapted to bond the electrode associated with the electronic element to the conductive paste by soldering, when the electrode is present in the electrode region.

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patent: 5152451 (1992-10-01), Darveaux et al.
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patent: 5373985 (1994-12-01), Chiba et al.
patent: 6617529 (2003-09-01), Ishizuka et al.
patent: 6697151 (2004-02-01), Owen et al.
patent: 6768197 (2004-07-01), Hosomi et al.
patent: 406350249 (1994-12-01), None

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