Printed wiring board and production thereof

Details Printed wiring board and production thereof Printed wiring board and production thereof

1993-06-17

1995-08-22

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174255, 174257, 174263, H05K 100

Patent

active

054441897

ABSTRACT:
A wiring board comprising one or more inner layer circuit substrates and outer circuit layers formed from metal foil layers on both sides of said dinner layer circuit substrates via prepregs, said inner layer circuit substrate comprising an insulating layer and metal foil layers formed on both sides of said insulating layer, at least one inner layer circuit substrate or said outer circuit layers or both having hollow portions in the metal foil layer filled with an electroconductive substance, said wiring board having one or more through-holes at least in the hollow portions and filled with the electroconductive substance, has high reliability and a high wiring density.

REFERENCES:
patent: 4374868 (1983-02-01), Stahl et al.
patent: 5072075 (1991-12-01), Lee et al.
Patent Abstracts of Japan, Application No. 64-14808, Oct. 17, 1990, vol. 14, No. 476.

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