Printed wiring board and process for producing thereof

Details Printed wiring board and process for producing thereof Printed wiring board and process for producing thereof

1995-09-14

1997-04-01

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 17, 216 19, 216 41, 216 86, B44C 122

Patent

active

056162561

ABSTRACT:
Disclosed is a printed wiring board 1 with a through hole 5 in which a hollow portion 7 wider than both an upper opening 5A and a lower opening 5A is formed, and a solder resist film 9 is formed at the hollow portion 7 so as to firmly adhere to an inner wall of the through hole 5. Thereby, it can prevent the solder resist film 9 from being dropped out from the through hole 5 and electrical check of circuit patterns on the printed wiring board 1 can be efficiently conducted while directly setting a checker pin 13 of a checker into the through hole 5.

REFERENCES:
patent: 5113315 (1992-05-01), Capp et al.
patent: 5342999 (1994-08-01), Frei et al.
patent: 5356755 (1994-10-01), Matsuda et al.
patent: 5387493 (1995-02-01), Imabayashi et al.

Affiliated with

Also associated with

Rating

Printed wiring board and process for producing thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and process for producing thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and process for producing thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-536468