Printed wiring board and process for producing the same

Details Printed wiring board and process for producing the same Printed wiring board and process for producing the same

1991-07-25

1993-09-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, 174266, H05K 100

Patent

active

052431428

ABSTRACT:
A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.

REFERENCES:
patent: 4006479 (1977-02-01), LaCombe
patent: 4317856 (1982-03-01), Huthwelker et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4967314 (1990-10-01), Higgins, III
C. J. McDermott, Face Protection of Printed Circuit Boards, IBM Technical Disclosure Bulletin, vol. 11, No. 7, Dec. 1968, p. 733.

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