Printed wiring board and method of manufacturing the same

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S830000, C029S840000, C029S846000

Reexamination Certificate

active

11210827

ABSTRACT:
The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a land and which enables high-density wiring design to be easily achieved. Provided is a method of manufacturing a printed wiring board in which wiring pattern forming layers are connected by a blind via hole, which includes the steps of forming a wiring pattern by etching at least metal foil laminated on a surface of an insulating layer and forming a land having a window portion in a portion where a blind via hole is to be formed; irradiating the window portion with a laser beam having a diameter larger than the diameter of the window portion but smaller than the diameter of the land, thereby making a nonthrough hole for forming the blind via hole; and forming a blind via hole by forming a plating on the nonthrough hole and the land.

REFERENCES:
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patent: 6373026 (2002-04-01), Kurosawa et al.
patent: 6590165 (2003-07-01), Takada et al.
patent: 6715204 (2004-04-01), Tsukada et al.
patent: 2002/0023778 (2002-02-01), Watanabe
patent: 2002/0083586 (2002-07-01), Iijima et al.
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patent: 2006/0137906 (2006-06-01), Hirata
patent: 2006/0202344 (2006-09-01), Takada et al.
patent: 0949855 (1999-10-01), None
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patent: 2000-31640 (2000-01-01), None
patent: 2002-26515 (2002-01-01), None
patent: 2002-198653 (2002-07-01), None
patent: 2004-319994 (2004-11-01), None
U.S. Appl. No. 11/452,321, filed Jun. 14, 2006, Hirata.

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