Printed wiring board and method of manufacturing the same

Details Printed wiring board and method of manufacturing the same Printed wiring board and method of manufacturing the same

2006-01-17

2006-01-17

Lam, Cathy F. (Department: 1775)

Coating processes

With post-treatment of coating or coating material

Chemical agent applied to treat coating

C427S096400, C427S123000, C216S065000

Reexamination Certificate

active

06986917

ABSTRACT:
A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

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Publication: The 9th National Convention Record JIPC, Mar., 1995, Tokyo.

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