Printed wiring board and method of manufacturing in which a base

Details Printed wiring board and method of manufacturing in which a base Printed wiring board and method of manufacturing in which a base

1995-10-04

1997-05-13

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, H05K 102

Patent

active

056294972

ABSTRACT:
A prepreg having an opening portion is placed on a cover lay which covers conductive circuits formed on a basefilm. A copper foil sheet is placed on the prepreg in such a way that the copper foil sheet covers the opening portion. The copper foil sheet has no opening portion. Next, the basefilm, the prepreg, and the copper foil are thermocompressed to become one laminate. After making a hole in the laminate, the laminate is plated, and then a through-hole is formed. A conductive circuit is formed by etching the copper foil sheet.

REFERENCES:
patent: 4800461 (1989-01-01), Dixon et al.
patent: 5045642 (1991-09-01), Ohta et al.
patent: 5095628 (1992-03-01), McKenny et al.
patent: 5262594 (1993-11-01), Edwin et al.
patent: 5499444 (1996-03-01), Doane, Jr. et al.

Affiliated with

Also associated with

Rating

Printed wiring board and method of manufacturing in which a base does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and method of manufacturing in which a base, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and method of manufacturing in which a base will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1387081